On April 19 2026, Odisha hosted the groundbreaking ceremony of Heterogeneous Integration Packaging Solutions (Three dimensional(3D) Glass Solutions), India’s first advanced glass semiconductor packaging unit, at Info Valley, Khordha district, Bhubaneswar, Odisha.
- Mohan Charan Majhi, Chief Minister(CM) of Odisha, graced the ceremony in the presence of Union Minister Ashwini Vaishnaw, Ministry of Electronics and Information Technology(MeitY).
About Advanced 3D Glass Chip Packaging Unit:
Developer: The project is being implemented by 3D Glass Solutions Inc. (3DGS), the United States of America(USA), through its wholly owned Indian subsidiary Heterogeneous Integration Packaging Solutions Private Limited (HIPSPL).
Investment: The project involves a total outlay of approximately Rs. 1,943.53 crore, supported by both Central Rs. 799 crore and State fiscal incentives of Rs. 399.5 crore under the India Semiconductor Mission (ISM).
Production Capacity: Once operational, the unit is projected to produce 70,000 glass panels, 50 million assembled units and around 13,000 advanced 3D Heterogeneous Integration (3DHI) modules annually.
Timeline: Commercial production is slated to begin by August 2028, with full-scale volume production targeted for 2030.
Applications: The chips will cater to key sectors such as aerospace, defence, artificial intelligence (AI), 5G technologies, and data centres.
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